microelectronic packaging meaning in Chinese

微电子组装
微型组装

The industry of microelectronic packaging equipments
微电子封装设备市场分析
Because the calculation of j - integral is much simpler than other method , and the multilayers and interfaces are ubiquitous in microelectronic packaging structures , it is expected that this method will be widely used in the calculation of the strain energy release rate in high density electrical packaging , especially
并通过实例证明，此新方法对于界面分层问题是可行的。由于j积分计算十分简便，因此扁平小矩形路径j积分方法有望在电子封装分层能量释放率计算中得到广泛的应用。